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Xeviora
Xeviora
| Capability Parameter | Volume Production | Sample Processing |
|---|---|---|
| Layer Count | 1-68 Layers | 64 Layers |
| Max Thickness | 10mm (394mil) | 14mm (551mil) |
| Min Line Width / Space (Inner Layer) | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Min Line Width / Space (Outer Layer) | 2.5mil / 2.5mil | 2.2mil / 2.2mil |
| Alignment with Core Board | ±25um | ±20um |
| Inner Layer Alignment | ±5mil | ±4mil |
| Max Copper Weight | 6 oz | 30 oz |
| Min Mechanical Drill Hole Size | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Min Laser Drill Hole Size | 0.1mm (4mil) | 0.050mm (2mil) |
| Max Unit Size | 850mm x 570mm | 1000mm x 600mm |
| Max Panel Size | 1250mm x 570mm | 1320mm x 600mm |
| Max Aspect Ratio (Unit) | 20:1 | 28:1 |
| Max Aspect Ratio (Panel) | 25:1 | 35:1 |
| Lead-Free / Halogen-Free Materials | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-Speed Materials | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| High-Frequency Materials | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Specialty Materials | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | |
| Surface Finishes | HAL, HAL-LF, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Hard Gold / Soft Gold Plating | |
| Special Technologies | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, Mixed RF PCB, Busbar PCB | |
We support a wide range of logistics and shipping methods to fit your delivery requirements:
| Layer Count | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | Negotiable | Negotiable | Negotiable |
We specialize in high-density multilayer printed circuit boards and specialty boards. Our product range includes impedance, high-frequency, high TG thick copper, 5G high-speed, buried blind via, metal-based, hybrid dielectric, HDI, rigid-flex, and custom PCBs.
Our manufacturing systems are compliant and certified with ISO 9001:2015, ISO 14001:2015, IATF 16949:2016, UL, CQC, RoHS, and REACH. We follow IPC standard guidelines for quality assurance and final inspection.
For double-layer PCBs, sample lead times can be as short as 24 hours, with standard production taking 6-7 days. For multilayer PCBs (e.g., 4-10 layers), sample lead times range from 36 hours to 4 days, and mass production takes 8-14 days depending on complexity.
We accept RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, and GC-CAM file formats.
We offer air shipping (UPS, DHL, TNT, CTS, and FEDEX), railway freight, seaborne logistics, or delivery using any customer-designated shipping account.
Yes. We handle more than 100 QTA (quick-turnaround) orders daily, supported by a 24-hour engineering team, 4-hour quote feedback, and complete engineering review within 4-8 hours.
