Xeviora
Xeviora
Engineered for dense server configurations, edge architectures, and demanding computing clusters.
DDR4 16GB 3200HZ Desktop RAM Server Memory RAM DDR3 4GB 8GB 16GB 32GB Memory Module
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Desktop Memory Module RAM DDR4 16GB 2666mhz Computer Memory RAM DDR4 RAM 1600MHz 2666mhz 2400MHz 3200MHz
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Hot Selling Heat Sink 320W LGA4189-N96 4U 6U Heat Pipe Heat Sink Suitable for Server Processors
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Factory wholesale radiator 350W AMD SP6 suitable for 2U server cooler CPU fan cooler
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Heat sink LGA115X-1U3E 110W square motherboard copper heat sink 1150 1151 1155 1156 1200 server CPU fan heat sink
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Computer Heatsink 120W BGA 2518 CPU Server Cooler Heatsink 120 * 84 * 28.5mm with Backplate
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300W LGA 4677 Desktop 2U Server Laptop CPU Heat Sink Cooler Cooling Fan with 4-pin
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Passive Extruded Aluminum Radiator LGA4677 Server Radiator CPU Air-cooled Radiator
Inquire SpecificationsDemystifying high-capacity memory architecture and critical thermal solutions for enterprise systems.
The enterprise ecosystem is undergoing an unprecedented shift toward next-generation memory profiles. As servers scale to support massive workloads like AI training, containerized virtualization, and heavy database querying, standard configurations no longer suffice. Incorporating DDR4 ECC modules and emerging DDR5 form factors ensures long-term operational resilience, lowering bit-error rates and minimizing system downtime.
Modern silicon configurations push thermal envelopes past previously established thresholds, with processors frequently exceeding 300W to 350W TDP (Thermal Design Power). Without precision-engineered CPU air cooling, copper baseplates, and high-performance heat pipes compatible with sockets like Intel’s LGA4677, LGA4189, and AMD's SP6, thermal throttling threatens system efficiency.
Developing a dependable, direct pipeline to experienced manufacturers in mainland China secures cost benefits, rapid prototyping capacity, and agile development pipelines. System integrators require agile partners capable of matching exact specifications, offering custom firmware configurations, and navigating international certification parameters seamlessly.
Harnessing advanced manufacturing ecosystems to optimize performance and reduce total cost of ownership (TCO).
1. Complete Integrated Supply Chain Clusters
In manufacturing hubs across Guangdong and key economic zones, the raw material procurement time is virtually zero. From raw copper fabrication and high-purity aluminum extrusion to advanced SMT (Surface Mount Technology) assembly lines, every process is localized. This allows factories like Xeviora Memory Technology to easily scale up custom production pipelines while drawing from a reliable local base of component suppliers.
2. Advanced Technological Infrastructure
Chinese production facilities are no longer just focused on manual assembly. They utilize automated testing machinery, optical inspection equipment (AOI), and precise thermodynamic testing chambers. This infrastructure ensures that passive radiators, heat pipe cooling setups, and memory modules meet strict quality baselines before shipping overseas.
3. Flexible Customization (OEM/ODM Models)
Whether your application calls for custom heat sink dimensions to fit a proprietary 1U edge server case, or specialized firmware configurations for legacy system compatibility, Chinese exporters offer flexible MOQ (Minimum Order Quantity) structures. They can quickly build mockups, optimize tooling, and refine designs to keep pace with changing market needs.
How our R&D team tackles modern processor thermal profiles and high-speed data transmission challenges.
In compact 1U and 2U server enclosures, airflow paths are highly restricted. Choosing between a passive extruded aluminum radiator (like our LGA4677 passive radiator) and active fan systems depends on case design and ambient temperature levels. Passive cooling utilizes system chassis fans to draw heat away, reducing point-of-failure risks. Active setups integrate direct high-CFM fans, perfect for high-heat hotspots.
Transporting heat efficiently away from multi-core processors requires advanced thermal conductors. Combining copper baseplates with sintered powder heat pipes allows CPU coolers to handle up to 350W TDP. This setup quickly transfers heat from the integrated heat spreader (IHS) of the CPU to large aluminum fin arrays, maintaining stable operating temperatures during heavy workloads.
DDR5 memory modules bring significant changes, moving power management directly onto the module with an onboard PMIC (Power Management Integrated Circuit). This design improves power efficiency but introduces new heat sources on the RAM itself. Our custom-designed heat spreaders are engineered to cool both the DRAM chips and the PMIC, ensuring high performance at speeds up to 4800MHz and beyond.
Optimizing networking equipment and component configurations for specific infrastructure demands.
High-density rack configurations demand low-latency, error-correcting memory and ultra-reliable passive cooling. Deploying DDR4/DDR5 ECC RDIMMs alongside 2U active copper coolers helps minimize downtime in virtualized environments, ensuring steady performance during CPU-intensive operations.
Edge devices operating in non-climate-controlled spaces require robust components. Industrial-grade memory modules paired with solid copper heatsinks handle wide temperature shifts and persistent vibrations, keeping critical field gateways running reliably.
Every microsecond matters in financial computing and gaming. Overclocked, low-latency desktop RAM modules with integrated heat spreaders ensure stable peak performance, avoiding data bottlenecks and thermal instability during intense processing bursts.
A trusted manufacturer of high-performance RAM solutions and cooling hardware.
Xeviora Memory Technology (China) Co., Ltd. is a professional DDR5 memory manufacturer and supplier based in China, specializing in high-performance RAM solutions for gaming, industrial, enterprise, and consumer applications. Established in 2017, the company has rapidly grown into a trusted OEM and ODM partner for global distributors, system integrators, and technology brands.
Our manufacturing facility covers 368 square meters and is equipped with advanced production and testing equipment to ensure stable quality and reliable performance. With an annual export revenue of over USD 18 million, Xeviora serves customers across North America, Europe, Southeast Asia, the Middle East, and South America.
Backed by 8 years of export experience and 12 years of industry expertise, we are committed to delivering innovative memory products that meet international quality standards. Our quality management system includes comprehensive incoming material inspection, in-process quality control, and final product testing. All products undergo automated functional testing, compatibility verification, performance validation, and aging tests before shipment. Our quality assurance team consists of 46 dedicated inspectors who ensure every module meets strict reliability requirements.
As a manufacturer with strong OEM and ODM capabilities, Xeviora works closely with more than 850 supply chain partners worldwide, enabling efficient sourcing, flexible production, and fast delivery. Our primary customers include wholesalers, distributors, e-commerce sellers, system builders, brand owners, and enterprise solution providers.
Innovation is at the core of our business. Supported by an experienced R&D team of 128 engineers, we continuously invest in new technologies and product development. Last year alone, we successfully launched 86 new memory products covering DDR5 gaming memory, industrial-grade memory modules, server memory solutions, and customized storage products.
We offer flexible customization services, including private labeling, logo printing, packaging design, specification customization, firmware optimization, and complete OEM/ODM development. Whether customers require standard memory modules or fully customized solutions, our team is dedicated to providing reliable products, competitive pricing, and professional technical support.
Steps we take to streamline overseas shipments, customs handling, and hardware certification.
Navigating global compliance is straightforward with our pre-certified hardware. All memory modules and cooling structures align with CE, FCC, RoHS, and WEEE directives, easing imports into European and North American markets. We provide comprehensive safety datasheets and performance profiles with every shipment.
For distributors and retailers, product presentation is key. We offer retail-ready packaging design, static-shielding blisters, and custom laser-engraving for brand logos. This allows you to integrate high-quality components into your product line with minimal overhead.
Working with reliable logistics networks ensures on-time delivery across North America, Europe, and Asia. From tracking raw material sourcing to offering post-sales technical support for custom firmware integration, we are here to support your supply chain at every stage.
Answers to key engineering and logistical questions for system integrators and purchasing teams.
Passive radiators rely on external chassis fans for airflow and are ideal for 1U or 2U servers with high-speed, high-static-pressure fans, as they remove moving parts from the heatsink. Active coolers, which feature integrated fans, are better suited for workstations or edge enclosures that lack dedicated, directed internal airflow.
ECC memory detects and corrects single-bit memory errors on the fly. This prevents system crashes and data corruption in business-critical environments, making it essential for financial platforms, cloud databases, and virtualization hosts.
Yes. As part of our OEM/ODM services, our R&D team can program custom SPD (Serial Presence Detect) settings, configure specific JEDEC timings, adjust voltage requirements, and optimize firmware for specialized motherboard configurations.
We use high-purity copper bases for rapid heat absorption, combined with multiple sintered copper heat pipes to quickly transfer thermal energy to dense aluminum fin stacks. These designs are precisely engineered to fit specific sockets, such as Intel LGA4677 and AMD SP6.
Our quality assurance process includes AOI (Automated Optical Inspection), X-ray component validation, functional burn-in tests under temperature stress, motherboard compatibility sweeps, and precise signal integrity analysis to guarantee long-term stability.
For standard components in stock, we ship within 3 to 7 business days. Custom OEM runs, which include custom packaging, branding, or specific component specifications, usually take 3 to 4 weeks depending on raw material sourcing and verification requirements.
Explore our full line of memory modules, gaming RAM, and custom server cooling assemblies.
Server Heatsink 205W LGA3647 2U Aluminum Fin 4 Heat Pipe Computer Aluminum Heatsink CPU Cooler
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Supplier Wholesale DDR4 16GB 3200MHz Desktop Memory Module Stock
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LAPTOP Computer Gaming Memory RAM DDR4 4GB 2666MHz Laptop Memory Card DDR4 8GB 3200MHz
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Hot Selling RAM Server Memory Module 4GB 8GB RAM 1333MHz Ddr3 Ecc Ddr3 1600MHz NB Computer Memory Module
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Hot Sale Bulk 2133mhz 2400mhz 2666mhz Heat Sink 4gb 8gb 16gb 288Pin Ecc Pc Desktop Memoria Rams With Heatsink Memory Ddr 4 Ddr4
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Laptop DDR4 ECC 16GB RAM Module 1600MHz 2400MHz 2666MHz 3200MHz in Stock
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Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
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95W LGA115X 1U Server Radiator Air-cooled Radiator Computer Server Radiator
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