Manufacturer supplies AMD SP3 1U server with high-power CPU heat sink, copper bottom cooling chip, and uniform heating version
| model |
TC009 |
| type |
AMD heat sink |
| texture of material |
Copper aluminum bonding |
| Bearing type |
Double ball bearings |
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Q1: Which server sockets is this CPU heat sink compatible with?
This heat sink is specifically designed for AMD SP3 sockets, making it an ideal choice for 1U servers requiring high-efficiency cooling.
Q2: What materials are used in the construction of this AMD heat sink?
The heat sink features a high-performance copper-aluminum bonding structure with a copper bottom to maximize thermal transfer efficiency.
Q3: What type of cooling fan bearing is utilized in this design?
It is equipped with industrial-grade double ball bearings, offering superior durability, long service life, and stable operation under continuous high-power loads.
Q4: Can this heat sink handle high-power CPU configurations?
Yes, the uniform heating design paired with high-performance copper bottom cooling chips is specifically optimized for high-power server CPUs in tight 1U spaces.
Q5: How is the product packaged for delivery to prevent damage?
We use professional, environmentally friendly, and highly protective packaging solutions to ensure that the heat sinks arrive safely at your location.
Q6: Is this product suitable for 24/7 continuous server operations?
Absolutely. The combination of double ball bearings and copper-aluminum bonding is engineered for the high-reliability demands of enterprise-level 24/7 server environments.
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