Xeviora
Xeviora
Engineered for high-frequency telecommunications, automotive electronics, and advanced sensors across France's industrial hubs.
France stands at the forefront of the European electronics shift, driven by major national initiatives like the France 2030 investment plan. This strategy funnels significant capital into the electrification of transport, high-end IoT medical devices, aerospace innovations, and renewable energy grids.
Industrial centers across Auvergne-Rhône-Alpes, Occitanie, and Île-de-France demand highly reliable electronic components. Both Single-Sided and Double-Sided PCBs represent the fundamental backbone of these sectors:
By coordinating with a highly efficient manufacturing partner in China, French companies bridge the gap between expensive local prototyping and high-capacity market deployment.
French electronics engineering requires conformity with CE markings, RoHS, and REACH directives. Our fabrication pipelines are optimized to meet these strict environmental and safety regulations.
With major clusters in Toulouse and Paris, French Tier-1 automotive and aerospace suppliers require high-frequency laminates (like Taconic and Rogers) combined with reliable copper plating processes.
Industry Expertise
Annual Export Revenue
R&D Engineers
QC Inspectors & Testers
Combining the design inputs of European engineers with the scale, precision, and efficiency of advanced Chinese manufacturing.
By maintaining strong partnerships with over 850 supply chain vendors, we procure raw substrates (FR4, CEM-1, Aluminum, Polyimide) at highly optimized rates, guaranteeing seamless production timelines even during peak global demands.
Our manufacturing floor integrates SMT line setups, high-precision flying probe testing, and automatic optical inspection (AOI). This setup facilitates mass volume manufacturing with zero manual errors, ensuring reliability in final installations.
With seasoned export mechanisms, we route packages directly to Paris-Charles de Gaulle or Marseille-Fos Port. We manage all export documentation and supply chains, ensuring smooth customs processing and prompt delivery.
Originally established in 2017 as a specialized memory chip manufacturer, Xeviora Memory Technology (China) Co., Ltd. has expanded into a full-scale electronics assembly and printed circuit board supplier. We integrate high-speed processing, thermal heat dissipation systems, and PCB layout design under one roof.
High-frequency modules, such as DDR5 gaming memory and enterprise server memory, demand tight physical layout tolerances (often down to 0.1mm trace spacing) and multi-phase thermal management. We translate these exact engineering standards into our Single-Sided and Double-Sided PCB production lines:
Advanced Production & Verification Facility Gallery:
Our state-of-the-art facilities ensure zero-defect output for industrial, automotive, and high-frequency French applications.
From smart grids in Lyon to electric drivetrains in Douai, discover how our custom circuits are deployed.
France’s national push for smart utility tracking requires durable, long-life single-sided boards. Utilizing high-durability epoxy FR4 substrates, our boards operate continuously in residential and commercial electrical meters, managing power distribution with minimal heat production.
Our aluminum-backed single-sided PCBs offer excellent thermal conductivity, keeping high-brightness LEDs cool in modern headlights. For dashboard controllers and EV auxiliary charging modules, our double-sided boards provide robust signal routing and high mechanical strength.
In automated production floors, factory equipment depends on high-sensitivity sensory circuits. We specialize in designing layout arrays that minimize electro-magnetic interference (EMI), maintaining clean signal transmission even in electrically noisy industrial environments.
We believe that reliability is the foundation of any long-term partnership. Our facility uses a thorough QA/QC structure to ensure that every circuit board is fully tested before dispatch.
Our quality management team consists of 46 dedicated inspectors who oversee each step of production, from raw laminate input to final circuit routing and surface finishing:
A full range of circuit components, high-density server memory, SMT assemblies, and passive/active heat dissipating solutions.
How technical and material advances are changing electronic design and production across Europe.
As micro-controllers process more data, they produce more heat. We are seeing a major shift from standard FR4 to aluminum and ceramic-filled substrates. This transition ensures reliable heat dissipation for automotive LEDs, battery management boards, and power adapters.
European environmental directives are driving the adoption of halogen-free flame retardants and organic finishes (like ENIG or Immersion Tin). Our production processes support these green finishes to ensure compliance with French environmental standards.
Even double-sided boards are adopting smaller geometries. By using advanced laser micro-via drilling, we can routing signals through trace/space distances smaller than 0.1mm, supporting compact designs for smart IoT modules and wearable tech.
Important questions regarding design limits, delivery logistics, and customized assembly solutions.
Send us your Gerber files and bill of materials (BOM). Our engineering team will review your project and provide a detailed quote within 24 hours.
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